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RAS Energy, Mechanics & ControlИзвестия Российской академии наук. Механика твердого тела Mechanics of Solids

  • ISSN (Print) 1026-3519
  • ISSN (Online) 3034-6428

Multifunctional shuttle for processing small diameter and ultra-thin semicon-ductor wafers

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PII
S30346428S1026351925020041-1
DOI
10.7868/S3034642825020041
Publication type
Article
Status
Published
Authors
N. A. Djuzhev
  • Affiliation: National Research University of Electronic Technology
E. E. Gusev
  • Affiliation: National Research University of Electronic Technology
M. Y. Fomichev
  • Affiliation: National Research University of Electronic Technology
P. S. Ivanin
  • Affiliation: National Research University of Electronic Technology
I. V. Kushnarev
  • Affiliation: National Research University of Electronic Technology
V. A. Bespalov
  • Affiliation: National Research University of Electronic Technology
Volume/ Edition
Volume / Issue number 2
Pages
68-82
Abstract
In a first for Russia, a 100 mm diameter wafer was processed to create holes for TSV structures using automated equipment designed for 150mm diameter wafers without needing to reconfigure the installations. A shuttle wafer was developed for this purpose. The reliability of the silicon shuttle was determined through experimental studies of the mechanical strength of silicon. The thickness of the ultra-thin Si wafer that can be processed without damage in the shuttle wafer on installations with a vacuum table was calculated based on the data obtained.
Keywords
микросборка трехмерная интеграция TSV рельеф поверхности фотолитография ПХТ временный бондинг
Date of publication
20.01.2026
Year of publication
2026
Number of purchasers
0
Views
18

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At the Ministry of Education and Science of the Russian Federation

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